SystemC/TLM Modeling of a Heterogeneous Chiplet Internship

Are you ready to embark on an exciting journey in the world of high-performance computing? SiPearl is now offering internship opportunities that will give you hands-on experience in cutting-edge technology.
About the internship:
🎯 Missions:
For its products lines technical requirements, SiPearl studies System on Chip (SoC) architecture based on chiplets. To go from concept to product, we develop virtual models enabling relevant simulations of each architecture in terms of calculations resources, memory and memory bandwidth. The results obtained validate our architectural choices.
Internship goal is to develop SystemC/TLM (Transaction-level modeling) models linked to a virtual platform of an inputs/outputs heterogeneous chiplet.
This internship is an opportunity to understand high-end multi-die technologies on advance silicon nodes (5 to 3 nm), processor architecture and SoC functional modeling
🔍What makes you a good match for the role:
- Master end of studies internship
- Python/C/C++
- SystemC and TLM notions.
- Knowledge of PCIe and DDR interfaces would be a plus.
📍 Location: Maisons- Laffitte
- Localisations
- Maisons-Laffitte
Maisons-Laffitte
À propos de SiPearl
Qu’ils soient seniors ou juniors, ingénieurs spécialisés en firmware embarqué, conception microélectronique, prototypage virtuel, modélisation & simulation ou développement logiciel...
Les membres de l’équipe SiPearl travaillent avec le meilleur des technologies microprocesseur mondiales : architecture multi-coeur, plateforme Neoverse® V1 du leader ARM, gravure 6 nm…
SystemC/TLM Modeling of a Heterogeneous Chiplet Internship
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